QSFP-DD 400G 30AWG-14P+26AWG-2P

QSFP-DD is mainly used for Ethernet switches, enabling interconnection between switches or servers It uses 8 channels and can run up to 50Gbps PAM4 modulation, providing a solution of up to 400Gbps aggregation, which can be achieved in a single switch slot 14,4Tbps aggregate bandwidth and solve the problem of rapid growth of data center traffic

 

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USB4, In 2019, USB-IF integrated the Thunderbolt 3 protocol (TBT3) on the basis of USB 3.2 , launched USB4 Gen 2x2 and USB4 Gen 3x2. The difference between the past is that the name USB 3.2 is still retained. USB4 is a doubling of the original USB 3.2 transmission speed, reaching 40Gbps, which is the speed of USB4 Gen 3x2. USB4 supports both USB 3.2 and TBT3 transfers. In short, USB4=USB 3.2+TBT3. USB4, like USB 3.2, also has single channel mode and dual channel mode. The USB4 interface and USB 3.2 interface both support the use of the USB PD fast charging protocol.

USB4 integrates multiple protocols as well as support more devices simultaneously, which involves bandwidth allocation. As shown in the figure below, USB4 can allocate up to 22Gbps of bandwidth for data transmission and at least 18GB of bandwidth for display support. Can connect a display with a resolution of 5120x2880 (5k), a refresh rate of 60Hz, and a color depth of 30bit, leaving 18Gbps of bandwidth for data transmission; You can also connect two videos with a resolution of 4096x2160 (4k), a refresh rate of 60Hz, and a color depth of 30bit, leaving 8Gbps of bandwidth for data transmission.

 

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Overview:PCIe cable is serial cable that uses differential signal transmission, the differential signal based on signal integrity theory; Adopting dual channel technology, PCI-Express adopts a dual channel transmission mode similar to full duplex communication technology. In terms of speed, PCI-Express v1.0a provides a transmission rate of 2.5Gb/s for each channel. Depending on the version, cable components for PCI Express expansion card applications can provide specifications such as PCIe X4, X8, and X16. This series of cable components includes high-speed cables such as MiniSAS, SATA, QSFP+, and SPF+.

The physical layer of PCIE implements a pair of transmit and receive differential pairs, which can achieve full duplex communication. The main PCIE structure is SAS structure, with CAT A, B, C, D, E structures selected for the wire. According to the test requirements, parameters that meet different specifications are designed.

 

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DisplayPort 2.1 DisplayPort cable standard, optimizes the configurations for full size and mini size DisplayPort cable, enhances its robustness, thereby improving connection quality and increasing cable length (DP40 cable exceeding 2 meters long, DP80 cable exceeding 1 meter long) without compromising UHBR performance. The DP40 cable certified by VESA supports UHBR10 link rate (10 Gbps), four channel operation, and provides a maximum throughput of 40Gbps; The DP80 cable certified by VESA supports UHBR20 link rate (20 Gbps), four channel operation, and provides a maximum throughput of 80 Gbps.

 

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USB, is abbreviation of"Universal Serial BUS". It is an external bus standard to standardize the connectiondu of computer and peripheral equipment and communications. Is the application interface in the PC fieldtechnology。 USB interface, Plug and Play and hot swap support equipment functions, USB is the end of 1994by Intel, Compaq, IBM, Microsoft and other companies jointly proposed.

The fourth Generation: USB 3.1(USB 3.1 Gen2) maximum transfer rate of 10Gbps, downward compatible with USB1.1/2.0/3.0

 

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Cable Construction
Section Item Hibest's requirement
Insulation1 Conductor
"26AWG 1/0.425±0.005mm
Silver Plated Copper"
Insulation PP
Thickness 0.30mm Nom./0.25mm Min
OD 1.42±0.03mm
Color Transparent
Insulation2 Conductor
"30AWG 1/0.28±0.005mm
Silver Plated Copper"
Insulation PP
Thickness 0.30mm Nom./0.25mm Min
OD 0.92±0.03mm
Color Transparent
Tape1 Drain
26AWG 1/0.404±0.005mm Tinned Copper
Material 1 10mmBlue AL foil&Hot melt Mylar0.015*6mm
Printing 2P Print:A01、A02
Tape1 Drain 30AWG 1/0.26±0.005mm Tinned Copper
Material 6mmBlue AL foil&Hot melt Mylar0.015*4mm
Printing 14P Print:A03、A04---A16
"Core 
stranding"
stranding 1 A01-A02Transparent Mylar 0.015*12mm Pitch:300mm
stranding 2
"A01-A02Transparent Mylar0.015*12mm 
Pitch:300mm"
stranding 3
"Stranding 2+A08/09/10/11/12/13/14/15/16 
Mylar0.015*24mm  AL foil 0.025*24mm Pitch:300mm"
Braid Material
"24*10/0.12±0.005mm Tinned Copper 
Braid Copper Coverage 85%"
OD 8.30±0.3mm
Jacket Material 60P PVC
Thickness 0.4mm Min AVG/0.30mm Min
OD
9.70±0.10mm
Color Black



Ⅱ.Physical Characteristics  

1. PP Insulation:Before aging:Tensile strength 3000PSI Min  Elongation:150% Min
2. PVC Insulation:Before aging:Tensile strength 1500PSI Min  Elongation:100% Min

 

Ⅲ.Printing:  

 30AWG*28C+26AWG*4C  HiBest uLDc®    www.hibest.com.cn

 

Ⅳ.Electrical Characteristics 

1.Conductor Resistance:354 Ohms/km Max@20℃
2.Differential impedance:100±5 Ohm@TDR 30ps risetime(20%~80%)
3.Intra-pair Skew 100ps risetime(20%~80%):≤10ps/Cable
4.Attenuntion SDD21:
-4.64dB/m Max.@12.5 MHz
-4.64dB/m Max.@1250 MHz
-6.74dB/m Max.@2500 MHz
-9.47dB/m Max.@5000 MHz
-11.6dB/m Max.@7000 MHz
-14.4dB/m Max.@10000 MHz
-17.1dB/m Max.@12890 MHz
-19.2dB/m Max.@15000 MHz
-22.3dB/m Max.@18000 MHz
-24.7dB/m Max.@20000 MHz
5.Diff To Comm_Convert SCD21:
-22dB/m Max.@12.5-20000 MHz
6.Return Loss SDD11&SDD22:
-16.05dB/m Max.@12.5 MHz
-12.5dB/m Max.@4100 MHz
-2.81dB/m Max.@20000 MHz
7.Withstand Voltage:300V/DC
8.Insulation Resistance:﹥300M Ohm

 

Ⅴ.Products meet environmental requirements

 

Ⅵ.Packing 

 
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